Substrate Material Product List and Ranking from 4 Manufacturers, Suppliers and Companies

Substrate Material Product List

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[Book] High Heat-Resistant Materials for Next-Generation Power Devices (No. 2260)

[Book] High Heat-Resistant Materials for Next-Generation Power Devices (No. 2260)

[Available for preview] ~ Substrate, Joining, Sealing, Cooling Technologies ~

Book Title: Development of High Heat-Resistant and High Heat-Dissipating Materials for Next-Generation Power Devices and Thermal Countermeasures －－－－－－－－－－－－－－－－－－－－－ ◎ Thorough explanation of Si, SiC, GaN, gallium oxide, required characteristics in automotive environments, and implementation examples! ◎ Detailed guidelines for designing TIMs and heat dissipation sheets that balance "thermal characteristics" and "operational reliability"! －－－－－－－－－－－－－－－－－－－－－ ■ This book includes the following information: - Improving the heat resistance of resins and measures against material expansion - Composite materials of thermally conductive fillers and resins - Development trends of resin substrates, ceramic substrates, and metal substrate materials - Countermeasures for failures such as warping, delamination, and breakage caused by inter-material stress due to linear expansion coefficients - Response to high-temperature operation above 300°C and low-temperature operation below freezing - Balancing thermal conductivity, mechanical properties, electrical insulation properties, and strength reliability - Improvement of thermal fatigue characteristics against repeated stress due to heat resistance and differences in linear expansion, and crack countermeasures - Suppression of electromigration and electrochemical migration - Ensuring moisture resistance, oxidation resistance, heat resistance, and long-term reliability of metal sintered materials

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Heat dissipation substrate material "Yupicel H" [An ultra-thin and super lightweight heat dissipation substrate material!]

Heat dissipation substrate material "Yupicel H" [An ultra-thin and super lightweight heat dissipation substrate material!]

Ultra-thin, lightweight heat dissipation substrate without adhesive type! It can be processed in three dimensions, allowing for the production of substrates in various shapes!

Ube Eximo's "Yupisel H" is a heat dissipation substrate material based on polyimide. By utilizing the high insulation breakdown characteristics of polyimide and reducing the thickness of the insulation layer, high heat dissipation can be achieved. It is characterized by its ability to be processed in three dimensions, making it suitable for LEDs and power modules. 【Features】 ■ It is an ultra-thin and super-lightweight heat dissipation substrate material. ■ Three-dimensional processing is possible, allowing for the creation of substrates in various shapes. ■ Roll processing is possible due to a unique continuous manufacturing method. ■ It does not use halogens. ■ It contains no ceramic fillers, resulting in good machinability. ■ It is suitable for chip-on-board (COB) mounting of bare chips. *For more details, please request materials or view the PDF data available for download.

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"Rich lineup of materials" We will accommodate specifications that meet our customers' wishes.

"Rich lineup of materials" We will accommodate specifications that meet our customers' wishes.

We also support the production of flex rigid! With a rich lineup of materials, we will meet your needs.

The "PCBs" we handle are available in standard thicknesses of 1.6t, as well as thinner options starting from 0.1t to thicker options up to 3.0t. Additionally, we have experience processing special thicknesses such as 4.2t. For "FPCs," we offer base materials and coverlay thicknesses of 12.5μ, 25μ, and 50μ, as well as materials without adhesive. Furthermore, since we have both "PCB" and "FPC" materials, we can also accommodate the production of flex-rigid boards and perform adhesive tape applications. Please feel free to reach out with any questions or inquiries! 【Features】 ■ We can accommodate the production of flex-rigid boards since we have both PCB and FPC materials. ■ The standard color for the resist is green, but we can also provide white, blue, and other colors. ■ We also perform adhesive tape applications. Leveraging our strength as a small but elite team, we respond flexibly to production needs! Please do not hesitate to contact us! *For more details, please refer to the PDF materials or feel free to inquire.

  • Digital Signage
  • Anemometer
  • Other PCs and OA equipment

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[Book] Latest Development Trends in High-Speed and High-Frequency Compatible Materials (2089BOD)

[Book] Latest Development Trends in High-Speed and High-Frequency Compatible Materials (2089BOD)

[Specialized Books] "Development of Low Dielectric Constant and Low Dielectric Loss Materials," "Millimeter Wave Compatible Electromagnetic Wave Absorbing and Shielding Materials," "Design of Antennas for 5G."

■ Points of this Book 【High-Frequency Substrate Materials】 - Characteristics and development of various substrate materials such as epoxy, polyimide, liquid crystal polymer, and fluorine - Development of new resins for 5G that achieve both "high heat resistance and low dielectric properties" - Surface modification and bonding techniques that enhance the adhesion between copper and resin without compromising smoothness 【5G Antennas】 - Antenna design technology for 5G smartphones - Reflectors and area construction applying metamaterial/metasurface technology - Antenna RF front-end modules that realize Massive MIMO in the high SHF band 【Electronic Components for 5G/Beyond 5G】 - Characteristics and technological trends of ceramic capacitors required for 5G - Technological trends and high-frequency advancements of SAW filters for 5G - Research and development trends of compound semiconductor devices for terahertz wireless communication 【Electromagnetic Wave Absorption and Shielding Materials】 - Design methods for wave absorbers and wave shields compatible with 5G millimeter waves - Applications of ceramics and carbon materials for wave absorption and shielding materials for millimeter waves 【Development and Integration Technology of Optical Devices】 - Development and integration technology of optical waveguides, optical modulators, and optical transceivers - Optical connection components and optical connection technology aimed at achieving co-packaging

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[LED] Lens Diffusion Plate: Types of substrate materials for LSD

[LED] Lens Diffusion Plate: Types of substrate materials for LSD

We also supply lens diffusion plates made of UV acrylic substrate that transmits 365nm light for UV inspection devices!

The "Lens Diffuser Plate: LSD" is characterized by its surface processing technology, which allows for easy selection of substrate materials. Substrate materials can include polycarbonate, polyester, acrylic, glass, quartz, and any film or sheet can be processed. In this column, we introduce various types of substrate materials such as "polycarbonate" and "polyester," so please take a moment to read it. [Contents] ■ Types of substrate materials for Lens Diffuser Plate: LSD *For more details, please refer to the PDF document or feel free to contact us.*

  • Lighting

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